Song, M., Ha, M., Shin, S., Kim, M., Son, S., Lee, J., Hwang, G.W., Kim, J., Duong, V.H., Park, J.H. and Pang, C. 2025. A Hierarchical Short Microneedle-Cupping Dual-Amplified Patch Enables Accelerated, Uniform, Pain-Free Transdermal Delivery of Extracellular Vesicles. Nano-Micro Letters. 18, (Jul. 2025), 11. DOI:https://doi.org/10.1007/s40820-025-01853-7.