WENG, H.; ZHANG, X.; LIU, X.; TANG, Y.; YUAN, H.; XU, Y.; LI, K.; HUANG, X. Enhanced Conductivity of Multilayer Copper–Carbon Nanofilms via Plasma Immersion Deposition. Nano-Micro Letters, [S. l.], v. 17, p. 130, 2025. DOI: 10.1007/s40820-024-01628-6. Disponível em: https://nmlett.org/index.php/nml/article/view/1914. Acesso em: 23 feb. 2025.