YAN, L.; LIU, Z.; WANG, J.; YU, L. Integrating Hard Silicon for High-Performance Soft Electronics via Geometry Engineering. Nano-Micro Letters, [S. l.], v. 17, p. 218, 2025. DOI: 10.1007/s40820-025-01724-1. Disponível em: https://nmlett.org/index.php/nml/article/view/2002. Acesso em: 24 apr. 2025.