Shi, S., Y. Jiang, H. Ren, S. Deng, J. Sun, F. Cheng, J. Jing, and Y. Chen. “3D-Printed Carbon-Based Conformal Electromagnetic Interference Shielding Module for Integrated Electronics”. Nano-Micro Letters, vol. 16, Jan. 2024, p. 85, doi:10.1007/s40820-023-01317-w.