Issue

Vol. 3 No. 3 (2011)

Fabrication of Superhydrophobic Surfaces on Aluminum Alloy Via Electrodeposition of Copper Followed by Electrochemical Modification

https://doi.org/10.1007/BF03353667
Ying Huang
University Research Center on Aluminum (CURAL), University of Qu´ebec at Chicoutimi, Chicoutimi, QC, Canada, G7H 2B1
D. K. Sarkar
University Research Center on Aluminum (CURAL), University of Qu´ebec at Chicoutimi, Chicoutimi, QC, Canada, G7H 2B1
X-Grant Chen
University Research Center on Aluminum (CURAL), University of Qu´ebec at Chicoutimi, Chicoutimi, QC, Canada, G7H 2B1

Corresponding Author: D. K. Sarkar

dsarkar@uqac.ca

Nano-Micro Letters, Vol. 3 No. 3 (2011), Article Number: 160-165

Abstract

Superhydrophobic aluminum surfaces have been prepared by means of electrodeposition of copper on aluminum surfaces, followed by electrochemical modification using stearic acid organic molecules. Scanning electron microscopy (SEM) images show that the electrodeposited copper films follow “island growth mode” in the form of microdots and their number densities increase with the rise of the negative deposition potentials. At an electrodeposition potential of −0.2 V the number density of the copper microdots are found to be 4.5×104 cm−2 that are increased to 2.9×105 cm−2 at a potential of −0.8 V. Systematically, the distances between the microdots are found to be reduced from 26.6 μm to 11.03 μm with the increase of negative electrochemical potential from −0.2V to −0.8V. X-ray diffraction (XRD) analyses have confirmed the formation of copper stearate on the stearic acid modified copper films. The roughness of the stearic acid modified electrodeposited copper films is found to increase with the increase in the density of the copper microdots. A critical copper deposition potential of −0.6V in conjunction with the stearic acid modification provides a surface roughness of 6.2 μm with a water contact angle of 157°, resulting in superhydrophobic properties on the aluminum substrates.

Keywords

Superhydrophobic aluminum surface Water contact angle Copper microdots Surface roughness Electrochemical modification
Huang, Ying, D. K. Sarkar, and X-Grant Chen. 2011. “Fabrication of Superhydrophobic Surfaces on Aluminum Alloy Via Electrodeposition of Copper Followed by Electrochemical Modification”. Nano-Micro Letters 3 (3):160-65. https://doi.org/10.1007/BF03353667.
Download Citation
Endnote/Zotero/Mendeley (RIS)
BibTeX
References
  1. T. L. Sun, L. Feng, X. F. Gao and L. Jiang, Accounts Chem. Res. 38, 644 (2005). http://dx.doi.org/10.1021/ar040224c
  2. W. Barthlott and C. Neinhuis, Planta 202, 1 (1997). http://dx.doi.org/10.1007/s004250050096
  3. X. Gao and L. Jiang, Nature 432, 36 (2004). http://dx.doi.org/10.1038/432036a
  4. Y. Zheng, X. Gao and L. Jiang, Soft Matter 3, 178 (2007). http://dx.doi.org/10.1039/b612667g
  5. J. Huang, X. Wang and Z. L. Wang, Nano Lett. 6, 2325 (2006). http://dx.doi.org/10.1021/nl061851t
  6. D. K. Sarkar and N. Saleema, Surf. Coat. Tech. 204, 2483 (2010). http://dx.doi.org/10.1016/j.surfcoat.2010.01.033
  7. A. Scardino, R. D. Nys, O. Ison, W. O’Connor and P. Steinberg, Biofouling 19, 221 (2003). http://dx.doi.org/10.1080/0892701021000057882
  8. A. Singh, L. Steely and H. R. Allcock, Polym. Prepr. (ACS, Div. Polym.Chem.) 46, 599 (2005).
  9. H. Gau, S. Herminghaus, P. Lenz and R. Lipowsky, Science 46, 283 (1996).
  10. T. Liu, Y. Yin, S. Chen, X. Chang and S. Cheng, Electrochimica Acta 52, 3709 (2007). http://dx.doi.org/10.1016/j.electacta.2006.10.059
  11. K. Satoh and H. Nakazumi, J. Sol-Gel Sci. Tech. 27, 327 (2003). http://dx.doi.org/10.1023/A:1024025104733
  12. D. K. Sarkar and M. Farzaneh, J. Adhes. Sci. Technol. 23, 1215 (2009). http://dx.doi.org/10.1163/156856109X433964
  13. D. K. Sarkar, M. Farzaneh and R. W. Paynter, Mater. Lett. 62, 1226 (2008). http://dx.doi.org/10.1016/j.matlet.2007.08.051
  14. A. Safaee, D. K. Sarkar and M. Farzaneh, Appl. Surf. Sci. 254, 2493 (2008). http://dx.doi.org/10.1016/j.apsusc.2007.09.073
  15. D. K. Sarkar, M. Farzaneh and R. W. Paynter, Appl. Surf. Sci. 256, 3698 (2010). http://dx.doi.org/10.1016/j.apsusc.2009.12.049
  16. N. Saleema, D. K. Sarkar, Farzaneh M. In: Mittal KL, editor. Contact angle, wettability and adhesion, vol. 5. Leiden: VSP/Brill; 2008. p. 279.
  17. D. K. Sarkar and M. Farzaneh In: Mittal KL, editor. Contact angle, wettability and adhesion, vol. 5. Leiden: VSP/Brill; 2008. p. 271.
  18. Y. Huang, D. K. Sarkar and X. Grant, Chen, Mater. Lett. 64, 2722 (2010). http://dx.doi.org/10.1016/j.matlet.2010.09.010
  19. N. Saleema, D. K. Sarkar, R. W. Paynter and X. G. Chen, ACS Appl. Mater. Interface. (Letters) 2, 2500 (2010). http://dx.doi.org/10.1021/am100563u
  20. D. K. Sarkar and R. W. Paynter, J. Adhesion Sci. Technol. 24, 1181 (2010). http://dx.doi.org/10.1163/016942409X12598231568546
  21. D. K. Sarkar and N. Saleema, Surf. Coat. Technol. 204, 2483 (2010). http://dx.doi.org/10.1016/j.surfcoat.2010.01.033
  22. D. K. Sarkar, X. J. Zhou, A. Tannous and K. T. Leung, J. Phys. Chem. B (Letters) 107, 2879 (2003). http://dx.doi.org/10.1021/jp0269524
  23. M. Volmer and A. Z. Weber, Phys. Chem. 119, 277 (1926).
  24. M. R. Khelladi, L. Mentar, A. Azizi, A. Sahari and A. Kahoul, Mater. Chem. Phys. 115, 385 (2009). http://dx.doi.org/10.1016/j.matchemphys.2008.12.017
  25. JCPDS Al (01-085-1327.
  26. JCPDS Cu (01-085-1326).
  27. S. K. Rawal, A. K. Chawla, V. Chawla, R. Jayaganthan and R. Chandra, Mater. Sci. Eng. B 172, 259 (2010). http://dx.doi.org/10.1016/j.mseb.2010.05.027
Read More
Author biographies are not available.
Download this PDF file
PDF
Statistic
Read Counter : 3181 Download : 2422