Issue

Vol. 17 (2025)

Integrating Hard Silicon for High-Performance Soft Electronics via Geometry Engineering

https://doi.org/10.1007/s40820-025-01724-1
Lei Yan
School of Electronic Science and Engineering/National Laboratory of Solid‑State Microstructures, Nanjing University, Nanjing 210023, People’s Republic of China
Zongguang Liu
College of Physics Science and Technology/Microelectronics Industry Research Institute, Yangzhou University, Yangzhou 225009, People’s Republic of China
Junzhuan Wang
School of Electronic Science and Engineering/National Laboratory of Solid‑State Microstructures, Nanjing University, Nanjing 210023, People’s Republic of China
Linwei Yu
School of Electronic Science and Engineering/National Laboratory of Solid‑State Microstructures, Nanjing University, Nanjing 210023, People’s Republic of China

Corresponding Author: Linwei Yu

yulinwei@nju.edu.cn

Nano-Micro Letters, Vol. 17 (2025), Article Number: 218

Abstract

Soft electronics, which are designed to function under mechanical deformation (such as bending, stretching, and folding), have become essential in applications like wearable electronics, artificial skin, and brain-machine interfaces. Crystalline silicon is one of the most mature and reliable materials for high-performance electronics; however, its intrinsic brittleness and rigidity pose challenges for integrating it into soft electronics. Recent research has focused on overcoming these limitations by utilizing structural design techniques to impart flexibility and stretchability to Si-based materials, such as transforming them into thin nanomembranes or nanowires. This review summarizes key strategies in geometry engineering for integrating crystalline silicon into soft electronics, from the use of hard silicon islands to creating out-of-plane foldable silicon nanofilms on flexible substrates, and ultimately to shaping silicon nanowires using vapor–liquid–solid or in-plane solid–liquid–solid techniques. We explore the latest developments in Si-based soft electronic devices, with applications in sensors, nanoprobes, robotics, and brain-machine interfaces. Finally, the paper discusses the current challenges in the field and outlines future research directions to enable the widespread adoption of silicon-based flexible electronics.


Highlights:
1 Crystalline silicon (c-Si) is one of the most mature and reliable materials for high-performance electronic devices and has garnered widespread attention in the field of flexible electronics.
2 This article examines the detailed transition enabled by geometry engineering from "3D bulk materials" to "2D thin films," and ultimately to "1D nanowires," highlighting the advancements and challenges in enhancing the flexibility and mechanical properties of c-Si.
3 We emphasize the forefront applications of silicon nanowires in wearable electronics and healthcare, aiming to accelerate the rapid development of c-Si within the realm of flexible electronics.

Keywords

Soft electronics Silicon Geometry engineering Silicon nanowires
Yan, Lei, Zongguang Liu, Junzhuan Wang, and Linwei Yu. 2025. “Integrating Hard Silicon for High-Performance Soft Electronics via Geometry Engineering”. Nano-Micro Letters 17 (April):218. https://doi.org/10.1007/s40820-025-01724-1.
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