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Vol. 15 (2023)

Self-Modifying Nanointerface Driving Ultrahigh Bidirectional Thermal Conductivity Boron Nitride-Based Composite Flexible Films

https://doi.org/10.1007/s40820-022-00972-9
Taoqing Huang
Department of Materials Science and State Key Laboratory of Molecular Engineering of Polymers, Fudan University, Shanghai 200433, People’s Republic of China
Xinyu Zhang
Department of Physics, University of Michigan–Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University, Shanghai 200240, People’s Republic of China
Tian Wang
Department of Chemistry, Fudan University, Shanghai 200433, People’s Republic of China
Honggang Zhang
Department of Physics, University of Michigan–Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University, Shanghai 200240, People’s Republic of China
Yongwei Li
Department of Materials Science and State Key Laboratory of Molecular Engineering of Polymers, Fudan University, Shanghai 200433, People’s Republic of China
Hua Bao
Department of Physics, University of Michigan–Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University, Shanghai 200240, People’s Republic of China
Min Chen
Department of Materials Science and State Key Laboratory of Molecular Engineering of Polymers, Fudan University, Shanghai 200433, People’s Republic of China
Limin Wu
Department of Materials Science and State Key Laboratory of Molecular Engineering of Polymers, Fudan University, Shanghai 200433, People’s Republic of China

Corresponding Author: Limin Wu

lmw@fudan.edu.cn

Nano-Micro Letters, Vol. 15 (2023), Article Number: 2

Abstract

While boron nitride (BN) is widely recognized as the most promising thermally conductive filler for rapidly developing high-power electronic devices due to its excellent thermal conductivity and dielectric properties, a great challenge is the poor vertical thermal conductivity when embedded in composites owing to the poor interfacial interaction causing severe phonon scattering. Here, we report a novel surface modification strategy called the “self-modified nanointerface” using BN nanocrystals (BNNCs) to efficiently link the interface between BN and the polymer matrix. Combining with ice-press assembly method, an only 25 wt% BN-embedded composite film can not only possess an in-plane thermal conductivity of 20.3 W m−1 K−1 but also, more importantly, achieve a through-plane thermal conductivity as high as 21.3 W m−1 K−1, which is more than twice the reported maximum due to the ideal phonon spectrum matching between BNNCs and BN fillers, the strong interaction between the self-modified fillers and polymer matrix, as well as ladder-structured BN skeleton. The excellent thermal conductivity has been verified by theoretical calculations and the heat dissipation of a CPU. This study provides an innovative design principle to tailor composite interfaces and opens up a new path to develop high-performance composites.


Highlights:


1 The flexible composite film presents ultrahigh thermal conductivity and good thermal management performance in electronic devices.
2 An original “self-modified nanointerface” strategy is used to reduce the interfacial thermal resistance between boron nitride and the polymer matrix.
3 The ideal phonon spectrum matching between boron nitride nanocrystals and fillers as well as the strong interaction between self-modified fillers and the polymer matrix are the two major contributors to decrease the interfacial thermal resistance.

Keywords

Thermal management materials Boron nitride Thermal conductivity Interfacial thermal resistance
Huang, Taoqing, Xinyu Zhang, Tian Wang, Honggang Zhang, Yongwei Li, Hua Bao, Min Chen, and Limin Wu. 2022. “Self-Modifying Nanointerface Driving Ultrahigh Bidirectional Thermal Conductivity Boron Nitride-Based Composite Flexible Films”. Nano-Micro Letters 15 (December):2. https://doi.org/10.1007/s40820-022-00972-9.
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References
  1. M.M. Waldrop, The chips are down for Moore’s law. Nature 530, 145–147 (2016). https://doi.org/10.1038/530144a
  2. C.P. Feng, F. Wei, K.Y. Sun, Y. Wang, H.B. Lan et al., Emerging flexible thermally conductive films: mechanism, fabrication, application. Nano-Micro Lett. 14, 127 (2022). https://doi.org/10.1007/s40820-022-00868-8
  3. Q. Cai, D. Scullion, W. Gan, A. Falin, S. Zhang et al., High thermal conductivity of high-quality monolayer boron nitride and its thermal expansion. Sci. Adv. (2019). https://doi.org/10.1126/sciadv.aav0129
  4. X. Shen, Q. Zheng, J.K. Kim, Rational design of two-dimensional nanofillers for polymer nanocomposites toward multifunctional applications. Prog. Mater. Sci. 115, 100708 (2021). https://doi.org/10.1016/j.pmatsci.2020.100708
  5. D. Pan, G. Yang, H.M. Abo-Dief, J. Dong, F. Su et al., Vertically aligned silicon carbide nanowires/boron nitride cellulose aerogel networks enhanced thermal conductivity and electromagnetic absorbing of epoxy composites. Nano-Micro Lett. 14, 118 (2022). https://doi.org/10.1007/s40820-022-00863-z
  6. J. Wang, D. Liu, Q. Li, C. Chen, Z. Chen et al., Nacre-bionic nanocomposite membrane for efficient in-plane dissipation heat harvest under high temperature. J. Materiomics 7, 219–225 (2021). https://doi.org/10.1016/j.jmat.2020.08.006
  7. J. Wang, Q. Li, D. Liu, C. Chen, Z. Chen et al., High temperature thermally conductive nanocomposite textile by “green” electrospinning. Nanoscale 10, 16868–16872 (2018). https://doi.org/10.1039/C8NR05167D
  8. J. Wang, Y. Wu, Y. Xue, D. Liu, X. Wang et al., Super-compatible functional boron nitride nanosheets/polymer films with excellent mechanical properties and ultra-high thermal conductivity for thermal management. J. Mater. Chem. C 6(6), 1363–1369 (2018). https://doi.org/10.1039/C7TC04860B
  9. J. Chen, X. Huang, B. Sun, P. Jiang, Highly thermally conductive yet electrically insulating polymer/boron nitride nanosheets nanocomposite films for improved thermal management capability. ACS Nano 13(1), 337–345 (2019). https://doi.org/10.1021/acsnano.8b06290
  10. K. Wu, J. Wang, D. Liu, C. Lei, D. Liu et al., Highly thermoconductive, thermostable, and super-flexible film by engineering 1D rigid rod-like aramid nanofiber/2D boron nitride nanosheets. Adv. Mater. 32(8), 1906939 (2020). https://doi.org/10.1002/adma.201906939
  11. X. Qian, J. Zhou, G. Chen, Phonon-engineered extreme thermal conductivity materials. Nat. Mater. 20, 1188–1202 (2021). https://doi.org/10.1038/s41563-021-00918-3
  12. A. Giri, P.E. Hopkins, A review of experimental and computational advances in thermal boundary conductance and nanoscale thermal transport across solid interfaces. Adv. Funct. Mater. 30(8), 1903857 (2019). https://doi.org/10.1002/adfm.201903857
  13. M.D. Losego, M.E. Grady, N.R. Sottos, D.G. Cahill, P.V. Braun, Effects of chemical bonding on heat transport across interfaces. Nat. Mater. 11, 502–506 (2012). https://doi.org/10.1038/nmat3303
  14. H. Wang, W. Xing, S. Chen, C. Song, M.D. Dickey et al., Liquid metal composites with enhanced thermal conductivity and stability using molecular thermal linker. Adv. Mater. 33(43), e2103104 (2021). https://doi.org/10.1002/adma.202103104
  15. F. Jiang, S. Cui, C. Rungnim, N. Song, L. Shi et al., Control of a dual-cross-linked boron nitride framework and the optimized design of the thermal conductive network for its thermoresponsive polymeric composites. Chem. Mater. 31, 7686–7695 (2019). https://doi.org/10.1021/acs.chemmater.9b02551
  16. Z. Liu, A. Dibaji, D. Li, S. Mateti, J. Liu et al., Challenges and solutions in surface engineering and assembly of boron nitride nanosheets. Mater. Today 44, 194–210 (2021). https://doi.org/10.1016/j.mattod.2020.11.020
  17. F. Sun, T. Zhang, M.M. Jobbins, Z. Guo, X. Zhang et al., Molecular bridge enables anomalous enhancement in thermal transport across hard-soft material interfaces. Adv. Mater. 26(35), 6093–6099 (2014). https://doi.org/10.1002/adma.201400954
  18. P.J. O’Brien, S. Shenogin, J. Liu, P.K. Chow, D. Laurencin et al., Bonding-induced thermal conductance enhancement at inorganic heterointerfaces using nanomolecular monolayers. Nat. Mater. 12, 118–122 (2013). https://doi.org/10.1038/nmat3465
  19. Y. Yao, J. Sun, X. Zeng, R. Sun, J.B. Xu et al., Construction of 3D skeleton for polymer composites achieving a high thermal conductivity. Small 14(13), e1704044 (2018). https://doi.org/10.1002/smll.201704044
  20. S. Plimpton, Fast parallel algorithms for short-range molecular-dynamics. J. Comput. Phys. 117, 1–19 (1995). https://doi.org/10.1006/jcph.1995.1039
  21. H. Sun, S.J. Mumby, J.R. Maple, A.T. Hagler, An ab-initio CFF93 all-atom force-field for polycarbonates. J. Am. Chem. Soc. 116(7), 2978–2987 (1994). https://doi.org/10.1021/ja00086a030
  22. A. Kinaci, J.B. Haskins, C. Sevik, T. Cagin, Thermal conductivity of BN-C nanostructures. Phys. Rev. B 86, 115410 (2012). https://doi.org/10.1103/PhysRevB.86.115410
  23. A.K. Rappe, C.J. Casewit, K.S. Colwell, W.A. Goddard, W.M. Skiff, UFF, a full periodic-table force-field for molecular mechanics and molecular-dynamics simulations. J. Am. Chem. Soc. 114(25), 10024–10035 (1992). https://doi.org/10.1021/ja00051a040
  24. S.L. Mayo, B.D. Olafson, W.A. Goddard, DREIDING - a generic force-field for molecular simulations. J. Phys. Chem. 94, 8897–8909 (1990). https://doi.org/10.1021/j100389a010
  25. R.L. Davidson, Handbook of Water-Soluble Gums and Resins (McGraw Hill, New York, 1980)
  26. Z. Lin, A. McNamara, Y. Liu, K.S. Moon, C.P. Wong, Exfoliated hexagonal boron nitride-based polymer nanocomposite with enhanced thermal conductivity for electronic encapsulation. Compos. Sci. Technol. 90, 123–128 (2014). https://doi.org/10.1016/j.compscitech.2013.10.018
  27. Z. Lin, Y. Liu, S. Raghavan, K.S. Moon, S.K. Sitaraman det al., Magnetic alignment of hexagonal boron nitride platelets in polymer matrix: toward high performance anisotropic polymer composites for electronic encapsulation. ACS Appl. Mater. Interfaces 5(15), 7633–7640 (2013).
  28. T. Huang, F. Yang, T. Wang, J. Wang, Y. Li et al., Ladder-structured boron nitride nanosheet skeleton in flexible polymer films for superior thermal conductivity. Appl. Mater. Today 26, 101299 (2022). https://doi.org/10.1016/j.apmt.2021.101299
  29. C. Lei, Y. Zhang, D. Liu, X. Xu, K. Wu et al., Highly thermo-conductive yet electrically insulating material with perpendicularly engineered assembly of boron nitride nanosheets. Compos. Sci. Technol. 214, 108995 (2021). https://doi.org/10.1016/j.compscitech.2021.108995
  30. L. An, X. Gu, B. Zhong, J. Wang, J. Zhang et al., Quasi-isotropically thermal conductive, highly transparent, insulating and super-flexible polymer films achieved by cross linked 2D hexagonal boron nitride nanosheets. Small 17(46), 2101409 (2021). https://doi.org/10.1002/smll.202101409
  31. C. Xiao, Y. Guo, Y. Tang, J. Ding, X. Zhang et al., Epoxy composite with significantly improved thermal conductivity by constructing a vertically aligned three-dimensional network of silicon carbide nanowires/ boron nitride nanosheets. Compos. Part B Eng. 187, 107855 (2020). https://doi.org/10.1016/j.compositesb.2020.107855
  32. M.A. Kashfipour, R.S. Dent, N. Mehra, X. Yang, J. Gu et al., Directional xylitol crystal propagation in oriented micro-channels of boron nitride aerogel for isotropic heat conduction. Compos. Sci. Technol. 182, 107715 (2019). https://doi.org/10.1016/j.compscitech.2019.107715
  33. X. Xu, R. Hu, M. Chen, J. Dong, B. Xiao et al., 3D boron nitride foam filled epoxy composites with significantly enhanced thermal conductivity by a facial and scalable approach. Chem. Eng. J. 397, 125447 (2020). https://doi.org/10.1016/j.cej.2020.125447
  34. Y. Yao, Z. Ye, F. Huang, X. Zeng, T. Zhang et al., Achieving significant thermal conductivity enhancement via an ice-templated and sintered BN-SiC skeleton. ACS Appl. Mater. Interfaces 12(2), 2892–2902 (2020). https://doi.org/10.1021/acsami.9b19280
  35. H. Hong, Y.H. Jung, J.S. Lee, C. Jeong, J.U. Kim et al., Anisotropic thermal conductive composite by the guided assembly of boron nitride nanosheets for flexible and stretchable electronics. Adv. Funct. Mater. 29(37), 1902575 (2019). https://doi.org/10.1002/adfm.201902575
  36. X. Wang, P. Wu, 3D vertically aligned BNNS network with long-range continuous channels for achieving a highly thermally conductive composite. ACS Appl. Mater. Interfaces 11(32), 28943–28952 (2019). https://doi.org/10.1021/acsami.9b09398
  37. J. Wang, D. Liu, Q. Li, C. Chen, Z. Chen et al., Lightweight, superelastic yet thermoconductive boron nitride nanocomposite aerogel for thermal energy regulation. ACS Nano 13(7), 7860–7870 (2019). https://doi.org/10.1021/acsnano.9b02182
  38. Y. Xue, X. Zhou, T. Zhan, B. Jiang, Q. Guo et al., Densely interconnected porous bn frameworks for multifunctional and isotropically thermoconductive polymer composites. Adv. Funct. Mater. 28(29), 1801205 (2018). https://doi.org/10.1002/adfm.201801205
  39. X. Li, C. Li, X. Zhang, Y. Jiang, L. Xia et al., Simultaneously enhanced thermal conductivity and mechanical properties of PP/BN composites via constructing reinforced segregated structure with a trace amount of BN wrapped PP fiber. Chem. Eng. J. 390, 124563 (2020). https://doi.org/10.1016/j.cej.2020.124563
  40. Q. Hu, X. Bai, C. Zhang, X. Zeng, Z. Huang et al., Oriented BN/silicone rubber composite thermal interface materials with high out-of-plane thermal conductivity and flexibility. Compos. Part A Appl. Sci. Manuf. 152, 106681 (2022). https://doi.org/10.1016/j.compositesa.2021.106681
  41. Z.G. Wang, J.C. Lv, Z.L. Zheng, J.G. Du, K. Dai et al., Highly thermally conductive graphene-based thermal interface materials with a bilayer structure for central processing unit cooling. ACS Appl. Mater. Interfaces 13(21), 25325–25333 (2021). https://doi.org/10.1021/acsami.1c01223
  42. Z.G. Wang, W. Liu, Y.H. Liu, Y. Ren, Y.P. Li et al., Highly thermal conductive, anisotropically heat-transferred, mechanically flexible composite film by assembly of boron nitride nanosheets for thermal management. Compos. Part B Eng. 180, 107569 (2020). https://doi.org/10.1016/j.compositesb.2019.107569
  43. Z.G. Wang, Y.F. Jin, R. Hong, J. Du, K. Dai et al., Dual-functional thermal management materials for highly thermal conduction and effectively heat generation. Compos. Part B Eng. 242, 110084 (2022). https://doi.org/10.1016/j.compositesb.2022.110084
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