Issue

Vol. 13 (2021)

Highly Stretchable Shape Memory Self-Soldering Conductive Tape with Reversible Adhesion Switched by Temperature

https://doi.org/10.1007/s40820-021-00652-0
Mengyan Wang
School of Materials Science and Engineering, National Institute for Advanced Materials, Tianjin Key Lab for Rare Earth Materials and Applications, Nankai University, Tongyan Road 38, Tianjin 300350, People’s Republic of China
Quan Zhang
School of Materials Science and Engineering, National Institute for Advanced Materials, Tianjin Key Lab for Rare Earth Materials and Applications, Nankai University, Tongyan Road 38, Tianjin 300350, People’s Republic of China
Yiwen Bo
School of Materials Science and Engineering, National Institute for Advanced Materials, Tianjin Key Lab for Rare Earth Materials and Applications, Nankai University, Tongyan Road 38, Tianjin 300350, People’s Republic of China
Chunyang Zhang
School of Materials Science and Engineering, National Institute for Advanced Materials, Tianjin Key Lab for Rare Earth Materials and Applications, Nankai University, Tongyan Road 38, Tianjin 300350, People’s Republic of China
Yiwen Lv
School of Materials Science and Engineering, National Institute for Advanced Materials, Tianjin Key Lab for Rare Earth Materials and Applications, Nankai University, Tongyan Road 38, Tianjin 300350, People’s Republic of China
Xiang Fu
School of Materials Science and Engineering, National Institute for Advanced Materials, Tianjin Key Lab for Rare Earth Materials and Applications, Nankai University, Tongyan Road 38, Tianjin 300350, People’s Republic of China
Wen He
School of Materials Science and Engineering, National Institute for Advanced Materials, Tianjin Key Lab for Rare Earth Materials and Applications, Nankai University, Tongyan Road 38, Tianjin 300350, People’s Republic of China
Xiangqian Fan
School of Materials Science and Engineering, National Institute for Advanced Materials, Tianjin Key Lab for Rare Earth Materials and Applications, Nankai University, Tongyan Road 38, Tianjin 300350, People’s Republic of China
Jiajie Liang
School of Materials Science and Engineering, National Institute for Advanced Materials, Tianjin Key Lab for Rare Earth Materials and Applications, Nankai University, Tongyan Road 38, Tianjin 300350, People’s Republic of China
Yi Huang
School of Materials Science and Engineering, National Institute for Advanced Materials, Tianjin Key Lab for Rare Earth Materials and Applications, Nankai University, Tongyan Road 38, Tianjin 300350, People’s Republic of China
Rujun Ma
School of Materials Science and Engineering, National Institute for Advanced Materials, Tianjin Key Lab for Rare Earth Materials and Applications, Nankai University, Tongyan Road 38, Tianjin 300350, People’s Republic of China
Yongsheng Chen
State Key Laboratory and Institute of Elemento‑Organic Chemistry, Centre of Nanoscale Science and Technology and Key Laboratory of Functional Polymer Materials, College of Chemistry, Nankai University, Weijin Road 94, Tianjin 300071, People’s Republic of China

Corresponding Author: Rujun Ma

malab@nankai.edu.cn

Nano-Micro Letters, Vol. 13 (2021), Article Number: 124

Abstract

With practical interest in the future applications of next-generation electronic devices, it is imperative to develop new conductive interconnecting materials appropriate for modern electronic devices to replace traditional rigid solder tin and silver paste of high melting temperature or corrosive solvent requirements. Herein, we design highly stretchable shape memory self-soldering conductive (SMSC) tape with reversible adhesion switched by temperature, which is composed of silver particles encapsulated by shape memory polymer. SMSC tape has perfect shape and conductivity memory property and anti-fatigue ability even under the strain of 90%. It also exhibits an initial conductivity of 2772 S cm−1 and a maximum tensile strain of ~ 100%. The maximum conductivity could be increased to 5446 S cm−1 by decreasing the strain to 17%. Meanwhile, SMSC tape can easily realize a heating induced reversible strong-to-weak adhesion transition for self-soldering circuit. The combination of stable conductivity, excellent shape memory performance, and temperature-switching reversible adhesion enables SMSC tape to serve two functions of electrode and solder simultaneously. This provides a new way for conductive interconnecting materials to meet requirements of modern electronic devices in the future.


Highlights:


1 Shape memory self-soldering tape used as conductive interconnecting material.
2 Perfect shape and conductivity memory performance and anti-fatigue performance.
3 Reversible strong-to-weak adhesion switched by temperature.

Keywords

Shape memory performance Self-soldering conductive tape Reversible adhesion Stretchable electronics
Wang, Mengyan, Quan Zhang, Yiwen Bo, Chunyang Zhang, Yiwen Lv, Xiang Fu, Wen He, Xiangqian Fan, Jiajie Liang, Yi Huang, Rujun Ma, and Yongsheng Chen. 2021. “Highly Stretchable Shape Memory Self-Soldering Conductive Tape With Reversible Adhesion Switched by Temperature”. Nano-Micro Letters 13 (May):124. https://doi.org/10.1007/s40820-021-00652-0.
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