Issue

Vol. 14 (2022)

Hierarchically Multifunctional Polyimide Composite Films with Strongly Enhanced Thermal Conductivity

https://doi.org/10.1007/s40820-021-00767-4
Yongqiang Guo
Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi’an 710072, Shaanxi, People’s Republic of China
Hua Qiu
Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi’an 710072, Shaanxi, People’s Republic of China
Kunpeng Ruan
Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi’an 710072, Shaanxi, People’s Republic of China
Yali Zhang
Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi’an 710072, Shaanxi, People’s Republic of China
Junwei Gu
Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi’an 710072, Shaanxi, People’s Republic of China

Corresponding Author: Junwei Gu

gjw@nwpu.edu.cn

Nano-Micro Letters, Vol. 14 (2022), Article Number: 26

Abstract

The development of lightweight and integration for electronics requires flexible films with high thermal conductivity and electromagnetic interference (EMI) shielding to overcome heat accumulation and electromagnetic radiation pollution. Herein, the hierarchical design and assembly strategy was adopted to fabricate hierarchically multifunctional polyimide composite films, with graphene oxide/expanded graphite (GO/EG) as the top thermally conductive and EMI shielding layer, Fe3O4/polyimide (Fe3O4/PI) as the middle EMI shielding enhancement layer and electrospun PI fibers as the substrate layer for mechanical improvement. PI composite films with 61.0 wt% of GO/EG and 23.8 wt% of Fe3O4/PI exhibits high in-plane thermal conductivity coefficient (95.40 W (m K)−1), excellent EMI shielding effectiveness (34.0 dB), good tensile strength (93.6 MPa) and fast electric-heating response (5 s). The test in the central processing unit verifies PI composite films present broad application prospects in electronics fields.


Highlights:


1 Hierarchically multifunctional polyimide composite films were fabricated by hierarchical design and assembly strategy.
2 Polyimide composite films have three functional layers and integrates high thermal conductivity (95.40 W (m K)−1), excellent EMI shielding (34.0 dB) and good tensile strength (93.6 MPa).
3 Polyimide composite films present broad application prospects in electronics fields according to the test results in the central processing unit.

Keywords

EMI shielding Flexible films Polyimide Thermal conductivity
Guo, Yongqiang, Hua Qiu, Kunpeng Ruan, Yali Zhang, and Junwei Gu. 2021. “Hierarchically Multifunctional Polyimide Composite Films With Strongly Enhanced Thermal Conductivity”. Nano-Micro Letters 14 (December):26. https://doi.org/10.1007/s40820-021-00767-4.
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