Issue

Vol. 16 (2024)

Flexible and Robust Functionalized Boron Nitride/Poly(p-Phenylene Benzobisoxazole) Nanocomposite Paper with High Thermal Conductivity and Outstanding Electrical Insulation

https://doi.org/10.1007/s40820-023-01257-5
Lin Tang
Chongqing Key Laboratory of Green Synthesis and Applications, College of Chemistry, Chongqing Normal University, Chongqing 401331, People’s Republic of China
Kunpeng Ruan
Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi’an 710072, People’s Republic of China
Xi Liu
Chongqing Key Laboratory of Green Synthesis and Applications, College of Chemistry, Chongqing Normal University, Chongqing 401331, People’s Republic of China
Yusheng Tang
Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi’an 710072, People’s Republic of China
Yali Zhang
Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi’an 710072, People’s Republic of China
Junwei Gu
Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi’an 710072, People’s Republic of China

Corresponding Author: Junwei Gu

gjw@nwpu.edu.cn

Nano-Micro Letters, Vol. 16 (2024), Article Number: 38

Abstract

With the rapid development of 5G information technology, thermal conductivity/dissipation problems of highly integrated electronic devices and electrical equipment are becoming prominent. In this work, “high-temperature solid-phase & diazonium salt decomposition” method is carried out to prepare benzidine-functionalized boron nitride (m-BN). Subsequently, m-BN/poly(p-phenylene benzobisoxazole) nanofiber (PNF) nanocomposite paper with nacre-mimetic layered structures is prepared via sol–gel film transformation approach. The obtained m-BN/PNF nanocomposite paper with 50 wt% m-BN presents excellent thermal conductivity, incredible electrical insulation, outstanding mechanical properties and thermal stability, due to the construction of extensive hydrogen bonds and π–π interactions between m-BN and PNF, and stable nacre-mimetic layered structures. Its λ∥ and λ⊥ are 9.68 and 0.84 W m−1 K−1, and the volume resistivity and breakdown strength are as high as 2.3 × 1015 Ω cm and 324.2 kV mm−1, respectively. Besides, it also presents extremely high tensile strength of 193.6 MPa and thermal decomposition temperature of 640 °C, showing a broad application prospect in high-end thermal management fields such as electronic devices and electrical equipment.


Highlights:
1 m-BN/PNF nanocomposite paper with nacre-mimetic layered structures prepared via sol–gel film transformation approach presents excellent thermal conductivity, incredible electrical insulation, outstanding mechanical property and thermal stability.
2 When the mass fraction of m-BN is 50 wt%, m-BN/PNF nanocomposite paper exhibits excellent thermal conductivity and electrical insulation. The λ∥ and λ⊥ are 9.68 and 0.84 W m−1 K−1, and the volume resistivity and breakdown strength are as high as 2.3 × 1015 Ω cm and 324.2 kV mm−1, respectively.
3 The m-BN/PNF nanocomposite paper with 50 wt% m-BN also presents outstanding mechanical properties (tensile strength of 193.6 MPa) and thermal stability (thermal decomposition temperature of 640 °C).

Keywords

Poly(p-phenylene-2,6-benzobisoxazole) nanofiber Boron nitride Thermal conductivity Electrical insulation
Tang, Lin, Kunpeng Ruan, Xi Liu, Yusheng Tang, Yali Zhang, and Junwei Gu. 2023. “Flexible and Robust Functionalized Boron Nitride/Poly(p-Phenylene Benzobisoxazole) Nanocomposite Paper With High Thermal Conductivity and Outstanding Electrical Insulation”. Nano-Micro Letters 16 (November):38. https://doi.org/10.1007/s40820-023-01257-5.
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