Issue

Vol. 16 (2024)

Highly Thermally Conductive and Structurally Ultra-Stable Graphitic Films with Seamless Heterointerfaces for Extreme Thermal Management

https://doi.org/10.1007/s40820-023-01277-1
Peijuan Zhang
MOE Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials and Technologies of Zhejiang Province, Zhejiang University, 38 Zheda Road, Hangzhou 310027, People’s Republic of China
Yuanyuan Hao
MOE Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials and Technologies of Zhejiang Province, Zhejiang University, 38 Zheda Road, Hangzhou 310027, People’s Republic of China
Hang Shi
MOE Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials and Technologies of Zhejiang Province, Zhejiang University, 38 Zheda Road, Hangzhou 310027, People’s Republic of China
Jiahao Lu
MOE Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials and Technologies of Zhejiang Province, Zhejiang University, 38 Zheda Road, Hangzhou 310027, People’s Republic of China
Yingjun Liu
MOE Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials and Technologies of Zhejiang Province, Zhejiang University, 38 Zheda Road, Hangzhou 310027, People’s Republic of China
Xin Ming
MOE Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials and Technologies of Zhejiang Province, Zhejiang University, 38 Zheda Road, Hangzhou 310027, People’s Republic of China
Ya Wang
MOE Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials and Technologies of Zhejiang Province, Zhejiang University, 38 Zheda Road, Hangzhou 310027, People’s Republic of China
Wenzhang Fang
MOE Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials and Technologies of Zhejiang Province, Zhejiang University, 38 Zheda Road, Hangzhou 310027, People’s Republic of China
Yuxing Xia
MOE Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials and Technologies of Zhejiang Province, Zhejiang University, 38 Zheda Road, Hangzhou 310027, People’s Republic of China
Yance Chen
MOE Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials and Technologies of Zhejiang Province, Zhejiang University, 38 Zheda Road, Hangzhou 310027, People’s Republic of China
Peng Li
MOE Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials and Technologies of Zhejiang Province, Zhejiang University, 38 Zheda Road, Hangzhou 310027, People’s Republic of China
Ziqiu Wang
MOE Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials and Technologies of Zhejiang Province, Zhejiang University, 38 Zheda Road, Hangzhou 310027, People’s Republic of China
Qingyun Su
Beijing Spacecrafts Manufacturing Co., Ltd, Beijing Friendship Road 104, Haidian District, Beijing 100094, People’s Republic of China
Weidong Lv
Beijing Institute of Space Mechanics and Electricity, Beijing Friendship Road 104, Haidian District, Beijing 100094, People’s Republic of China
Ji Zhou
Beijing Institute of Space Mechanics and Electricity, Beijing Friendship Road 104, Haidian District, Beijing 100094, People’s Republic of China
Ying Zhang
China Academy of Aerospace Aerodynamics, Beijing 100074, People’s Republic of China
Haiwen Lai
Hangzhou Gaoxi Technol Co., Ltd, Hangzhou 311113, People’s Republic of China
Weiwei Gao
MOE Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials and Technologies of Zhejiang Province, Zhejiang University, 38 Zheda Road, Hangzhou 310027, People’s Republic of China
Zhen Xu
MOE Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials and Technologies of Zhejiang Province, Zhejiang University, 38 Zheda Road, Hangzhou 310027, People’s Republic of China
Chao Gao
MOE Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials and Technologies of Zhejiang Province, Zhejiang University, 38 Zheda Road, Hangzhou 310027, People’s Republic of China

Corresponding Author: Chao Gao

chaogao@zju.edu.cn

Nano-Micro Letters, Vol. 16 (2024), Article Number: 58

Abstract

Highly thermally conductive graphitic film (GF) materials have become a competitive solution for the thermal management of high-power electronic devices. However, their catastrophic structural failure under extreme alternating thermal/cold shock poses a significant challenge to reliability and safety. Here, we present the first investigation into the structural failure mechanism of GF during cyclic liquid nitrogen shocks (LNS), which reveals a bubbling process characterized by “permeation-diffusion-deformation” phenomenon. To overcome this long-standing structural weakness, a novel metal-nanoarmor strategy is proposed to construct a Cu-modified graphitic film (GF@Cu) with seamless heterointerface. This well-designed interface ensures superior structural stability for GF@Cu after hundreds of LNS cycles from 77 to 300 K. Moreover, GF@Cu maintains high thermal conductivity up to 1088 W m−1 K−1 with degradation of less than 5% even after 150 LNS cycles, superior to that of pure GF (50% degradation). Our work not only offers an opportunity to improve the robustness of graphitic films by the rational structural design but also facilitates the applications of thermally conductive carbon-based materials for future extreme thermal management in complex aerospace electronics.


Highlights:
1 Presenting the first investigation into the structurally bubbling-failure mechanism of graphitic film during cyclic liquid nitrogen shocks.
2 Proposing an innovative design about seamless heterointerface constructing a Cu-modified structure.
3 Inventing a new ultra-stable species of highly thermally conductive films to inspire new techniques for efficient and extreme thermal management.

Keywords

Highly thermally conductive Structurally ultra-stable Graphitic film Extreme thermal management Liquid nitrogen bubbling
Zhang, Peijuan, Yuanyuan Hao, Hang Shi, Jiahao Lu, Yingjun Liu, Xin Ming, Ya Wang, Wenzhang Fang, Yuxing Xia, Yance Chen, Peng Li, Ziqiu Wang, Qingyun Su, Weidong Lv, Ji Zhou, Ying Zhang, Haiwen Lai, Weiwei Gao, Zhen Xu, and Chao Gao. 2023. “Highly Thermally Conductive and Structurally Ultra-Stable Graphitic Films With Seamless Heterointerfaces for Extreme Thermal Management”. Nano-Micro Letters 16 (December):58. https://doi.org/10.1007/s40820-023-01277-1.
Download Citation
Endnote/Zotero/Mendeley (RIS)
BibTeX
References
  1. H. Song, J. Liu, B. Liu, J. Wu, H.-M. Cheng et al., Two-dimensional materials for thermal management applications. Joule 2(3), 442–463 (2018). https://doi.org/10.1016/j.joule.2018.01.006
  2. H.F. Hamann, A. Weger, J.A. Lacey, Z. Hu, P. Bose et al., Hotspot-limited microprocessors: direct temperature and power distribution measurements. IEEE J. Solid-State Circuits 42(1), 56–65 (2007). https://doi.org/10.1109/jssc.2006.885064
  3. J.L. Smoyer, P.M. Norris, Brief historical perspective in thermal management and the shift toward management at the nanoscale. Heat Transf. Eng. 40(3–4), 269–282 (2018). https://doi.org/10.1080/01457632.2018.1426265
  4. A.K. Sikder, N. Sikder, A review of advanced high performance, insensitive and thermally stable energetic materials emerging for military and space applications. J. Hazard. Mater. 112(1–2), 1–15 (2004). https://doi.org/10.1016/j.jhazmat.2004.04.003
  5. T. Ghidini, Materials for space exploration and settlement. Nat. Mater. 17(10), 846–850 (2018). https://doi.org/10.1038/s41563-018-0184-4
  6. C. Conficoni, A. Bartolini, A. Tilli, C. Cavazzoni, L. Benini, Integrated energy-aware management of supercomputer hybrid cooling systems. IEEE Trans. Ind. Inf. 12(4), 1299–1311 (2016). https://doi.org/10.1109/tii.2016.2569399
  7. K. Wirtz, Thermal diffusion in nuclear reactor fuels. J. Am. Chem. Soc. 90(12), 3098–3099 (2002). https://doi.org/10.1021/ja01014a021
  8. J. Sayers, J. Walker, Nuclear reactor operation in space. Nature 211(5044), 60 (1966). https://doi.org/10.1038/211060a0
  9. J.A. Aguiar, A.M. Jokisaari, M. Kerr, R. Allen Roach, Bringing nuclear materials discovery and qualification into the 21(st) century. Nat. Commun. 11(1), 2556 (2020). https://doi.org/10.1038/s41467-020-16406-2
  10. K.F. Man, A.R. Hoffman, Testing of the mars exploration rovers to survive the extreme thermal environments. J. Microelectron. Electron. Packag. 4(4), 145–154 (2007). https://doi.org/10.4071/1551-4897-4.4.145
  11. Q.F. Guan, H.B. Yang, Z.M. Han, L.C. Zhou, Y.B. Zhu et al., Lightweight, tough, and sustainable cellulose nanofiber-derived bulk structural materials with low thermal expansion coefficient. Sci. Adv. 6(18), eaaz1114 (2020). https://doi.org/10.1126/sciadv.aaz1114
  12. W.B. Sun, Z.M. Han, X. Yue, H.Y. Zhang, K.P. Yang et al., Nacre-inspired bacterial cellulose/mica nanopaper with excellent mechanical and electrical insulating properties by biosynthesis. Adv. Mater. 35, e2300241 (2023). https://doi.org/10.1002/adma.202300241
  13. L. Lee, X.C. Cheng, L. Zhang, A high efficiency and low vibration liquid nitrogen cooling system for silicon crystal based x-ray optics. Rev. Sci. Instrum. 91(10), 103105 (2020). https://doi.org/10.1063/5.0016119
  14. H.X. Xiong, S.H. Yi, H.L. Ding, L. Jin, J.J. Huo, Research on head cooling of high-speed aircraft by liquid nitrogen. Aeronaut. J. 125(1284), 389–409 (2020). https://doi.org/10.1017/aer.2020.86
  15. K.W. Nam, S.H. Ahn, Crack opening behavior of penetrated crack under fatigue load. KSME Int. J. 16(1), 24–31 (2002). https://doi.org/10.1007/bf03185152
  16. A.M. Khounsary, R.A. Riddle, A.F. Bernhardt, Microchannel heatsink with liquid-nitrogen cooling. High Heat Flux Eng. 1739, 51–59 (1993). https://doi.org/10.1117/12.140527
  17. V. Drach, J. Fricke, Transient heat transfer from smooth surfaces into liquid nitrogen. Cryogenics 36(4), 263–269 (1996). https://doi.org/10.1016/0011-2275(96)88785-6
  18. A.D. Misener, F.T. Hedgcock, Tensile strength of liquid nitrogen. Nature 171(4358), 835–836 (1953). https://doi.org/10.1038/171835b0
  19. X. Zhong, K. Ruan, J. Gu, Enhanced thermal conductivities of liquid crystal polyesters from controlled structure of molecular chains by introducing different dicarboxylic acid monomers. Research 2022, 9805686 (2022). https://doi.org/10.34133/2022/9805686
  20. Y. Zhang, C. Lei, K. Wu, Q. Fu, Fully organic bulk polymer with metallic thermal conductivity and tunable thermal pathways. Adv. Sci. 8(14), e2004821 (2021). https://doi.org/10.1002/advs.202004821
  21. X. Chen, K. Wu, Y. Zhang, D. Liu, R. Li et al., Tropocollagen-inspired hierarchical spiral structure of organic fibers in epoxy bulk for 3D high thermal conductivity. Adv. Mater. 34(40), e2206088 (2022). https://doi.org/10.1002/adma.202206088
  22. S. Chen, W. Li, X. Li, W. Yang, One-dimensional sic nanostructures: Designed growth, properties, and applications. Prog. Mater. Sci. 104, 138–214 (2019). https://doi.org/10.1016/j.pmatsci.2019.04.004
  23. V. Guerra, C. Wan, T. McNally, Thermal conductivity of 2d nano-structured boron nitride (bn) and its composites with polymers. Prog. Mater. Sci. 100, 170–186 (2019). https://doi.org/10.1016/j.pmatsci.2018.10.002
  24. Y. Yang, X. Huang, Z. Cao, G. Chen, Thermally conductive separator with hierarchical nano/microstructures for improving thermal management of batteries. Nano Energy 22, 301–309 (2016). https://doi.org/10.1016/j.nanoen.2016.01.026
  25. M.S.B. Hoque, Y.R. Koh, J.L. Braun, A. Mamun, Z. Liu et al., High in-plane thermal conductivity of aluminum nitride thin films. ACS Nano 15(6), 9588–9599 (2021). https://doi.org/10.1021/acsnano.0c09915
  26. J. Wang, D. Liu, Q. Li, C. Chen, Z. Chen et al., Lightweight, superelastic yet thermoconductive boron nitride nanocomposite aerogel for thermal energy regulation. ACS Nano 13(7), 7860–7870 (2019). https://doi.org/10.1021/acsnano.9b02182
  27. J. Wang, Y. Wu, Y. Xue, D. Liu, X. Wang et al., Super-compatible functional boron nitride nanosheets/polymer films with excellent mechanical properties and ultra-high thermal conductivity for thermal management. J. Mater. Chem. C 6(6), 1363–1369 (2018). https://doi.org/10.1039/c7tc04860b
  28. J. Wang, T. Yang, Z. Wang, X. Sun, M. An et al., A thermochromic, viscoelastic nacre-like nanocomposite for the smart thermal management of planar electronics. Nano-Micro Lett. 15(1), 170 (2023). https://doi.org/10.1007/s40820-023-01149-8
  29. J. Wang, Q. Li, D. Liu, C. Chen, Z. Chen et al., High temperature thermally conductive nanocomposite textile by “green” electrospinning. Nanoscale 10(35), 16868–16872 (2018). https://doi.org/10.1039/c8nr05167d
  30. A.L. Woodcraft, Recommended values for the thermal conductivity of aluminum of different purities in the cryogenic to room temperature range, and a comparison with copper. Cryogenics 45(9), 626–636 (2005). https://doi.org/10.1016/j.cryogenics.2005.06.008
  31. Q. Shen, M. Jiang, R. Wang, K. Song, M.H. Vong et al., Liquid metal-based soft, hermetic, and wireless-communicable seals for stretchable systems. Science 379(6631), 488–493 (2023). https://doi.org/10.1126/science.ade7341
  32. M.H. Malakooti, N. Kazem, J. Yan, C. Pan, E.J. Markvicka et al., Liquid metal supercooling for low-temperature thermoelectric wearables. Adv. Funct. Mater. 29(45), 1906098 (2019). https://doi.org/10.1002/adfm.201906098
  33. G. Xin, T. Yao, H. Sun, S.M. Scott, D. Shao et al., Highly thermally conductive and mechanically strong graphene fibers. Science 349(6252), 1083–1087 (2015). https://doi.org/10.1126/science.aaa6502
  34. J. Zhong, W. Sun, Q. Wei, X. Qian, H.M. Cheng et al., Efficient and scalable synthesis of highly aligned and compact two-dimensional nanosheet films with record performances. Nat. Commun. 9(1), 3484 (2018). https://doi.org/10.1038/s41467-018-05723-2
  35. X. Ming, A. Wei, Y. Liu, L. Peng, P. Li et al., 2D-topology-seeded graphitization for highly thermally conductive carbon fibers. Adv. Mater. 34(28), e2201867 (2022). https://doi.org/10.1002/adma.202201867
  36. F. Wang, W. Fang, X. Ming, Y. Liu, Z. Xu et al., A review on graphene oxide: 2d colloidal molecule, fluid physics, and macroscopic materials. Appl. Phys. Rev. 10(1), 0128899 (2023). https://doi.org/10.1063/5.0128899
  37. W. Dai, T. Ma, Q. Yan, J. Gao, X. Tan et al., Metal-level thermally conductive yet soft graphene thermal interface materials. ACS Nano 13(10), 11561–11571 (2019). https://doi.org/10.1021/acsnano.9b05163
  38. L. Peng, Z. Xu, Z. Liu, Y. Guo, P. Li et al., Ultrahigh thermal conductive yet superflexible graphene films. Adv. Mater. 29(27), 1700589 (2017). https://doi.org/10.1002/adma.201700589
  39. H. Huang, X. Ming, Y. Wang, F. Guo, Y. Liu et al., Polyacrylonitrile-derived thermally conductive graphite film via graphene template effect. Carbon 180, 197–203 (2021). https://doi.org/10.1016/j.carbon.2021.04.090
  40. Z. Han, J. Wang, S. Liu, Q. Zhang, Y. Liu et al., Electrospinning of neat graphene nanofibers. Adv. Fiber. Mater. 4(2), 268–279 (2021). https://doi.org/10.1007/s42765-021-00105-8
  41. S. Luo, L. Peng, Y. Xie, X. Cao, X. Wang et al., Flexible large-area graphene films of 50–600 nm thickness with high carrier mobility. Nano-Micro Lett. 15(1), 61 (2023). https://doi.org/10.1007/s40820-023-01032-6
  42. M. Cao, S. Liu, Q. Zhu, Y. Wang, J. Ma et al., Monodomain liquid crystals of two-dimensional sheets by boundary-free sheargraphy. Nano-Micro Lett. 14(1), 192 (2022). https://doi.org/10.1007/s40820-022-00925-2
  43. P. Liu, X. Li, P. Min, X. Chang, C. Shu et al., 3d lamellar-structured graphene aerogels for thermal interface composites with high through-plane thermal conductivity and fracture toughness. Nano-Micro Lett. 13(1), 22 (2020). https://doi.org/10.1007/s40820-020-00548-5
  44. W. Dai, X.J. Ren, Q. Yan, S. Wang, M. Yang et al., Ultralow interfacial thermal resistance of graphene thermal interface materials with surface metal liquefaction. Nano-Micro Lett. 15(1), 9 (2022). https://doi.org/10.1007/s40820-022-00979-2
  45. C.P. Feng, F. Wei, K.Y. Sun, Y. Wang, H.B. Lan et al., Emerging flexible thermally conductive films: Mechanism, fabrication, application. Nano-Micro Lett. 14(1), 127 (2022). https://doi.org/10.1007/s40820-022-00868-8
  46. I. Gouzman, E. Grossman, R. Verker, N. Atar, A. Bolker et al., Advances in polyimide-based materials for space applications. Adv. Mater. 31(18), e1807738 (2019). https://doi.org/10.1002/adma.201807738
  47. A. Norman, S. Das, T. Rohr, T. Ghidini, Advanced manufacturing for space applications. CEAS Space J. 15(1), 1–6 (2022). https://doi.org/10.1007/s12567-022-00477-6
  48. H.A. Atwater, A.R. Davoyan, O. Ilic, D. Jariwala, M.C. Sherrott et al., Materials challenges for the starshot lightsail. Nat. Mater. 17(10), 861–867 (2018). https://doi.org/10.1038/s41563-018-0075-8
  49. S. Wan, X. Li, Y. Chen, N. Liu, Y. Du et al., High-strength scalable mxene films through bridging-induced densification. Science 374(6563), 96–99 (2021). https://doi.org/10.1126/science.abg2026
  50. S. Wan, Y. Chen, S. Fang, S. Wang, Z. Xu et al., High-strength scalable graphene sheets by freezing stretch-induced alignment. Nat. Mater. 20(5), 624–631 (2021). https://doi.org/10.1038/s41563-020-00892-2
  51. K. Shen, P. Li, J. Lin, Z. Wang, G. Cai et al., Intercalated oligomer doubles plasticity for strong and conductive graphene papers and composites. Carbon 208, 160–169 (2023). https://doi.org/10.1016/j.carbon.2023.03.036
  52. P. Li, M. Yang, Y. Liu, H. Qin, J. Liu et al., Continuous crystalline graphene papers with gigapascal strength by intercalation modulated plasticization. Nat. Commun. 11, 2645 (2020). https://doi.org/10.1038/s41467-020-16494-0
  53. P.A. Misra, I. Manousakis, E. Choukse, M. Jalili, I. Goiri et al., Overclocking in immersion-cooled datacenters. IEEE Micro 42(4), 10–17 (2022). https://doi.org/10.1109/mm.2022.3163107
  54. K. Pang, X. Song, Z. Xu, X. Liu, Y. Liu et al., Hydroplastic foaming of graphene aerogels and artificially intelligent tactile sensors. Sci. Adv. 6(46), eabd4045 (2020). https://doi.org/10.1126/sciadv.abd4045
  55. J. Wang, A.V. Nguyen, S. Farrokhpay, A critical review of the growth, drainage and collapse of foams. Adv. Colloid Interface Sci. 228, 55–70 (2016). https://doi.org/10.1016/j.cis.2015.11.009
  56. L. Li, J. Xu, G. Li, X. Jia, Y. Li et al., Preparation of graphene nanosheets by shear-assisted supercritical CO2 exfoliation. Chem. Eng. J. 284, 78–84 (2016). https://doi.org/10.1016/j.cej.2015.08.077
  57. Z. Sun, Q. Fan, M. Zhang, S. Liu, H. Tao et al., Supercritical fluid-facilitated exfoliation and processing of 2d materials. Adv. Sci. 6(18), 1901084 (2019). https://doi.org/10.1002/advs.201901084
  58. D.-J. Liaw, K.-L. Wang, Y.-C. Huang, K.-R. Lee, J.-Y. Lai et al., Advanced polyimide materials: syntheses, physical properties and applications. Prog. Polym. Sci. 37(7), 907–974 (2012). https://doi.org/10.1016/j.progpolymsci.2012.02.005
  59. K. Yang, Z. Zhang, H. Zhao, B. Yang, B. Zhong et al., Orientation independent heat transport characteristics of diamond/copper interface with ion beam bombardment. Acta Mater. 220, 117283 (2021). https://doi.org/10.1016/j.actamat.2021.117283
  60. Z. Wei, W. Ju, K. Bi, J. Yang, Y. Chen, Significant enhancement of thermal boundary conductance in graphite/al interface by ion intercalation. Int. J. Heat Mass Transf. 157, 119946 (2020). https://doi.org/10.1016/j.ijheatmasstransfer.2020.119946
  61. K.M. Yang, Y.C. Ma, Z.Y. Zhang, J. Zhu, Z.B. Sun et al., Anisotropic thermal conductivity and associated heat transport mechanism in roll-to-roll graphene reinforced copper matrix composites. Acta Mater. 197, 342–354 (2020). https://doi.org/10.1016/j.actamat.2020.07.021
  62. M. Blank, L. Weber, Influence of interfacial structural disorder and/or chemical interdiffusion on thermal boundary conductance for ti/si and au/si couples. J. Appl. Phys. 126(15), 155302 (2019). https://doi.org/10.1063/1.5114671
  63. C.-J. Twu, J.-R. Ho, Molecular-dynamics study of energy flow and the kapitza conductance across an interface with imperfection formed by two dielectric thin films. Phys. Rev. B 67(20), 205422 (2003). https://doi.org/10.1103/PhysRevB.67.205422
  64. J. Wang, Z. Wang, K. Yang, N. Chen, J. Ni et al., Enhanced heat transport capability across boron nitride/copper interface through inelastic phonon scattering. Adv. Funct. Mater. 32(40), 2206545 (2022). https://doi.org/10.1002/adfm.202206545
  65. X.D. Zhang, G. Yang, B.Y. Cao, Bonding-enhanced interfacial thermal transport: Mechanisms, materials, and applications. Adv. Mater. Interfaces 9(27), 2200078 (2022). https://doi.org/10.1002/admi.202200078
  66. Y. Liu, J. Guo, E. Zhu, L. Liao, S.J. Lee et al., Approaching the schottky-mott limit in van der waals metal-semiconductor junctions. Nature 557(7707), 696–700 (2018). https://doi.org/10.1038/s41586-018-0129-8
  67. M. Cao, D.B. Xiong, L. Yang, S. Li, Y. Xie et al., Ultrahigh electrical conductivity of graphene embedded in metals. Adv. Funct. Mater. 29(17), 1806792 (2019). https://doi.org/10.1002/adfm.201806792
  68. H. Peng, X. Ming, K. Pang, Y. Chen, J. Zhou et al., Highly electrically conductive graphene papers via catalytic graphitization. Nano Res. 15(6), 4902–4908 (2022). https://doi.org/10.1007/s12274-022-4130-z
  69. S. Zhang, X. Liu, C. Jia, Z. Sun, H. Jiang et al., Integration of multiple heterointerfaces in a hierarchical 0D@2D@1D structure for lightweight, flexible, and hydrophobic multifunctional electromagnetic protective fabrics. Nano-Micro Lett. 15, 204 (2023). https://doi.org/10.1007/s40820-023-01179-2
  70. Z. Nan, W. Wei, Z. Lin, J. Chang, Y. Hao, Flexible nanocomposite conductors for electromagnetic interference shielding. Nano-Micro Lett. 15, 172 (2023). https://doi.org/10.1007/s40820-023-01122-5
Read More
Author biographies are not available.
Statistic
Read Counter : 3536 Download : 2619

Most read articles by the same author(s)

1 2 > >>